The idea is to shrink the Top and Bottom Skin layers from 10 cm to 9.5 cm. This extra 5 mm and the additional few millimeters are used to place the PCB's in the "outer walls" instead of vertically stacked on the inside.
This extra payload volume may be used for a mini 3D printer as North Dakota University intends.
The slid PCB's shown in the image are acting a support structure. However, this may be replaced once the payload structure is designed.
This is simply an attempt to combine two designs.More work is needed on battery placement, heat regulation, and inner support.
Creative Commons Attribution Share Alike